Application of Solution Mapping to Reduce Computational Time in Actively Cooled Power Electronics
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Application of Solution Mapping to Reduce Computational Time in Actively Cooled Power Electronics

Kirk Lowe, Oak Ridge National Laboratory, and Rao V. Arimilli, University of Tennessee

In some power electronic applications the available coolant temperature is close to maximum and controlling operating temperature becomes more challenging, for which new thermal management schemes must be considered. COMSOL predicts the 3D fluid behavior and 3D temperature distribution within an actively cooled power electronic structure.

A solution mapping method is implemented to more efficiently model axisymmetric flows that lie within the heat exchanger and maintain the chip below maximum operating temperature, but fluid temperature exceeds its boiling point. Increasing fluid velocity reduces maximum fluid temperature below boiling point and demonstrates feasibility using high temperature coolant with power electronics.

Thermal performance of coolant channel design is modeled using the COMSOL Multiphysics fluid-themal interaction solver.

User Comments

Narendra Beliganur
Jun 30, 2009 at 5:38pm UTC

Nice!

Vladimir Derekic
Jan 19, 2011 at 1:14pm UTC

Nice!

ding liuwei
Nov 8, 2011 at 6:32am UTC

so nice

macky lee
Nov 22, 2013 at 5:33am UTC

Great post... Thanks for sharing... looking forward for more..
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Jun Chu
Mar 16, 2014 at 1:26am UTC

nice

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