Parametric Study of Polyimide - Lead Zirconate Titanate Thin Film Cantilevers for Transducer Applications
A. Arevalo, I.G. Foulds
King Abdullah University of Science and Technology, Thuwal, Kingdom of Saudi Arabia
The simulation of the piezoelectric actuation of the micro-cantilever is presented. Lead Zirconate Titanate (PZT) was chosen for the device fabrication design, due to its thin film processing flexibility. Four layers compose the cantilever structures presented in this work: PZT (piezoelectric material), Platinum (electrodes) and Zirconium Oxide as the buffer layer for the PZT film and polyimide ...
T.Madhuranath, R.Praharsha, Dr.K.Srinivasa Rao
Lakireddy Bali Reddy College of Engineering, Mylavaram, Andhra Pradesh, India
MEMS is the leading technology which combines both electronic and mechanical devices on a single microchip. Tracing the position of the object is an important problem in engineering. This can be addressed by Gyroscopes. These sensors are used to find orientation and angular velocity. This paper focuses on 3D MEMS Piezoelectric Gyroscope. COMSOL Multiphysics® is used for designing and ...
M.A. Rojas, and V. Grechka
 University of Houston
 Shell International E&P
We present static and dynamic computations of the apparent properties for stacks of horizontal isotropic layers (VTI symmetry). The effective stiffness tensors of such media are given by the Backus theory for statics in the limit of zero thicknesses of the constituent layers. We used COMSOL Multiphysics to verify the theoretical static bounds for these effective stiffnesses.
E. Isaza, E. Salazar, L. Florez
Universidad Tecnológica de Pereira, Pereira, Risaralda, Colombia
The consequences of hip fracture and femoral fracture are widely known. The mechanical strength of the femur varies in every person, but it is possible to predict the mechanical resistance with parameters like density, dimensions and mineral content. This paper uses different models and empirical studies to determine the mechanical properties of the human femur, developing isotropic and ...
VLSI Layout Based Design Optimization of a Piezoresistive MEMS Pressure Sensors using COMSOL Multiphysics
R. Komaragiri, Sarath. S., N. Kattabomman
NIT Calicut, Kozhikode, Kerala
This paper focuses on the diaphragm design and optimization of a piezoresistive Micro Electro Mechanical System (MEMS) pressure sensor by considering Very Large Scale Integration (VLSI) layout schemes. The aim of these studies is to find an optimal diaphragm shape by Finite Element Method (FEM) using COMSOL®, which is most suitable for VLSI layout. Optimal diaphragm shape is a diaphragm shape ...
Scale-up Design of Ultrasound Irradiator for Advanced Oxidation Process (AOP) Using COMSOL Multiphysics® Simulation
The Ohio State University, Columbus, OH, USA
Ultrasound is a promising green technology for the advanced oxidation process (AOP) since it adds no chemicals to the treated water. In this paper, COMSOL Multiphysics® was used as a tool to design and characterize an ultrasound irradiator with multi-stepped configuration, which aims to overcome disadvantages of typical irradiators and to enhance contaminant removal in large-scale water ...
G.E. Stavroulakis, K. Giannis, G.A. Drosopoulos, M.E. Stavroulaki
Technical University of Crete, Chania, Greece
Leibniz University, Hannover, Germany
Numerical homogenization is based on the use of finite elements for the description of average properties of materials with heterogeneous microstructure and composites. The Representative Volume Element (RVE) of a masonry is solved with COMSOL Multiphysics®. It consists of linearly elastic bricks and elastoplastic mortar joints. A parametric analysis is applied for increasing loading. Results ...
G. Maizza, and R. Cagliero
Politecnico di Torino, Corso Duca degli Abruzzi 24, Torino, Italy
Instrumented indentation is increasingly used as an alternative non-destructive test method to measure mechanical properties of small volumes of materials. In this work, the instrumented indentation test is applied as a non-destructive method to assess the mechanical properties of TiAl components during the setup of a real production process. This study is a preliminary contribution devoted to ...
D. van den Ende
Holst Centre / TNO, Eindhoven, The Netherlands
Ultra-thin chips of less than 20µm become flexible, allowing integration of silicon IC technology with flexible electronics. The ultra-thin chips in these products can be bent to a very high curvature,
A. van Wijhe, W. de Jong
Process & Energy, 3mE, TU Delft, The Netherlands
A COMSOL Multiphysics® model was made to design a mechanical amplifier and radiation plate for the emission of high intensity 40.5 kHz ultrasound to air by means of a Langevin type transducer usually applied in cleaning baths for example. In this work, ultrasonic irradiation is aimed at acting on flue gas containing fine particulate matter to realize a shift to higher effective particle sizes as ...