Jun 13, 2019 Fairborn, Ohio10:00 AM - 4:00 PM

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You are invited to join us at COMSOL Day Dayton/Fairborn for a day of minicourses, talks by invited speakers, and the opportunity to exchange ideas with other simulation specialists in the COMSOL community.

Below, you will find a preliminary schedule for COMSOL Day. Minicourse topics may include heat transfer, high-frequency electromagnetics, optics, acoustics, fluid flow, solvers, optimization, postprocessing, RF, antennas, and more. You are welcome to attend any portion of the event.

Stay tuned for more details. A full event schedule will be announced soon.

Register for free today.


Welcoming Remarks

This introductory demonstration will show you the fundamental workflow of the COMSOL Multiphysics® modeling environment. We will demonstrate the process of transforming fully defined models into specialized simulation applications. Get introduced to application deployment products such as COMSOL Compiler™ and COMSOL Server™.

Coffee Break

Learn how to model electromagnetic heating for low- and high-frequency electromagnetics applications. Important electromagnetic heating phenomena covered include Joule heating, induction heating, RF heating, and laser heating.

Break for Lunch

In this session, a panel of users from industry will share their experiences on best modeling practices and validation methods they follow while using COMSOL Multiphysics® to improve modeling efficiencies.


Get a brief overview of using the Acoustics Module and Structural Mechanics Module within the COMSOL® software environment.

Coffee Break

Learn how to model mass, momentum, and energy transport in order to simulate nonisothermal flow including chemical reactions in COMSOL Multiphysics®.


Learn to use gradient-based and derivative-free optimization techniques to define and solve problems in shape, parameter, and topology optimization. The techniques shown are applicable for almost all types of models.

COMSOL Day Details


Holiday Inn Dayton / Fairborn
Challenger/Discovery Room 2800 Presidential Drive
Fairborn, Ohio 45324

COMSOL Speakers

Yeswanth Rao

Yeswanth Rao is a technical sales manager and has been with COMSOL since early 2008. He holds a PhD in biological engineering and a master's degree in electrical engineering. His finite element background is in MEMS, particularly piezoelectric modeling.

Nithin Jacob

Nithin Jacob joined COMSOL in 2015 and currently works as a technical sales engineer. He received a master's degree in mechanical engineering from Arizona State University and his interests include structural mechanics and product development.

Aline Tomasian

Aline Tomasian is an applications engineer at COMSOL, specializing in high- and low-frequency electromagnetics. She holds a BS in physics from Worcester Polytechnic Institute.

Temesgen Kindo

Temesgen Kindo works at COMSOL as an applications engineer, specializing in structural mechanics and equation-based modeling. Before joining the Burlington, MA office, Temesgen received his PhD in civil engineering from Duke University. He is interested in nonlinear mechanics, multiphysics problems, and applied mathematics.

Luke Gritter
AltaSim Technologies

Invited Speakers

Folusho Oyerokun
GE Aviation
Dr. Folusho Oyerokun is a materials scientist in the Engineering Materials Systems department at GE Aviation in Cincinnati, OH. He received his graduate degrees from the Massachusetts Institute of Technology (SM in aeronautics and astronautics, with specialization in propulsion) and the University of Illinois, Urbana-Champaign (PhD in materials science and engineering, specializing in polymer statistical mechanics). Dr. Oyerokun has an extensive background and experience in theoretical and computational (atomistic and continuum) modeling of thermofluids and nanostructured polymeric and ceramic materials. At GE Aviation, Dr. Oyerokun uses {:comsolmph} to model the thermophysical processes involved during the manufacturing of ceramic matrix composites components for gas turbine engine applications.
Rick Beyerle
NeoGraf Solutions, LLC.
Rick Beyerle is a senior development engineer and heat transfer specialist at NeoGraf Solutions, LLC. Rick is responsible for developing measurement and modeling techniques for graphite heat spreaders, thermal interface materials (TIMs), and gap pads as well as nonelectronics applications of graphite. His work on SpreaderCalc, a web-based COMSOL® application for simulating heat flow in highly anisotropic graphite foils, appeared in COMSOL’s Multiphysics Simulation 2016.
Kyle Koppenhoefer
AltaSim Technologies
Kyle Koppenhoefer has been one of the principals and leaders at AltaSim Technologies for 15 years. He works with customers to identify how computational analysis can be used to further develop their products and manufacturing processes. Prior to cofounding AltaSim, Kyle worked for the Department of Defense and the Edison Welding Institute. He holds a PhD in civil engineering from the University of Illinois.
Nathanael May
Nathanael May has a BS and MS in materials science and engineering from Virginia Tech. He is currently a senior research scientist at GrafTech International. He has worked in GrafTech International’s Technology Group for eight years, among other roles, performing extensive multiphysics modeling for materials and applications such as carbon fibers, crystal growth furnaces, electric arc furnaces, and graphite manufacturing.

Register for COMSOL Day Dayton/Fairborn

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