October 14, 2021 9:30 a.m.–4:30 p.m. CEST

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COMSOL Day: Micro- and Nanotechnologies

See what is possible with multiphysics simulation

The physics associated with micro- and nanotechnologies can often be challenging to simulate. Such components and devices are found within electronics, medical devices, automotive sensors, and actuators — and have much to do with the internet of things.

COMSOL Day: Micro- and Nanotechnologies will address these challenges by showcasing examples and applications through a series of invited keynote presentations. COMSOL technical staff will also discuss modeling strategies, features, and benefits within COMSOL Multiphysics® that enable streamlined design processes.

For a global market that is estimated to be worth close to €500B in 2025, adding an edge to your organization through the use of simulation can only be of benefit.

View the schedule below and register for free today.

Schedule

9:15 a.m.
Registration
9:30 a.m.
Welcoming Remarks
9:45 a.m.

Simulation tools are indispensable for design and analysis in micro- and nanotechnologies. Multiphysics modeling, in particular, is crucial to understanding micro- and nanotech devices on the component level, since at these small scales, the interaction of physics becomes more pronounced. This session will focus on the current trends in multiphysics for micro- and nanotechnology, and explore ways to empower more engineers through R&D organizations to perform simulation by using multiphysics apps.

10:15 a.m.
Q&A
10:30 a.m.

Alexandre Reinhardt, CEA Leti

Elastic or acoustic wave resonators are the building blocks of the several tens of bandpass filters that can be found in recent mobile phones. These filters make it possible to manage geographic disparities in the allocation of the radio frequency spectrum; ensure backward compatibility with previous communication standards (2G, 3G, 4G, and now 5G); and ensure the coexistence of multiple applications (Wi-Fi, Bluetooth®, and GPS) while allowing increasingly large amounts of data rates to be transmitted wirelessly. This particular class of MEMS devices relies on elastic waves propagating in piezoelectric materials to form miniaturized mechanical resonant cavities that also exhibit electrical resonances. They exploit either surface acoustic waves propagating at the surface of a substrate or bulk acoustic waves propagating in the thickness of thin piezoelectric films. In both cases, the continuous improvements in operation frequencies, bandwidths, selectivity, miniaturization, and loss reductions call for precisely harnessing the behavior of elastic waves in multimaterial structures with complex micro- to nanoscale geometries. Hence, numerical simulation is an invaluable tool to develop new generations of resonators and filters and decrease time to market.

In this presentation, we will first discuss challenges toward full-wave simulation of such devices: large aspect ratios and/or the repetition over a large number of the same geometrical unit cell. We will also discuss cumulating multiple physical effects: mechanical and electrical, as well as thermal and propagation of radiofrequency signals. We will then introduce some useful simplifications usually adopted by the industry to simulate first-order effects, sufficient to design components with a satisfying accuracy. We will also discuss how numerical simulation can help investigate second-order effects, especially acoustic leakage and quality factor degradations, for the purpose of mitigating losses and avoiding spurious modes. Finally, we will open the discussion to some new trends from the last few years, bridging the gap between extreme simplification of the problem and precise modeling of complete devices or the modeling of nonlinear effects.

10:50 a.m.
Q&A
11:00 a.m.

Lanny Liang, STMicroelectronics

Characterization of thermal warpage introduced during manufacturing is one of the main tasks for microelectronics packaging, which significantly influences the heat transfer performance in application. Mismatch of the material coefficient of thermal expansion (CTE) values in the material additive processes acts as the root cause of package warpage, which is additionally affected by the material distribution and fixation time. With the Thermomechanical interface and the Activation boundary condition in COMSOL Multiphysics®, the warpage mechanism during multiple thermal processes can be analyzed.

11:20 a.m.
Q&A
11:30 a.m.
Parallel Session
Tech Café : Multiphysics Simulation

Multiphysics is inherent to micro- and nanodevices. A small deviation in one physical quantity can lead to a major change for another. For example, consider the common phenomena of thermodilatation and microfluid–structure interaction. Sometimes, you want to avoid these interactions; at other times, they can be used advantageously. Moreover, how the multiphysics are computed can be an important question to address. Do you want a fully coupled simulation or would it be better to use sequential or segregated solvers? All of these questions will be addressed in this Tech Café with invited speakers Olga Cueto from CEA Leti and Sébastien Kawka, application manager at COMSOL France.

Thermomechanical Modeling

In modeling of devices on the micro- and nanoscales, capturing thermodilatation phenomena is essential. This is because temperature distributions often lead to hot spots, where thermal warpage can lead to disaster. In these situations, it is crucial to accurately evaluate heat transfer and the way it interacts with structures. In this session, we will see how to implement and solve such a thermomechanical multiphysics model using the COMSOL Multiphysics® environment.

12:15 p.m.
Break for Lunch
1:10 p.m.
Welcome Back: Some Useful Resources
1:15 p.m.
Parallel Session
Tech Café: Multilayer and High-Aspect-Ratio Modeling

Designs in microtechnologies and nanotechnologies naturally lead to layered structures with high aspect ratios. This makes simulating these designs a challenge, since you must deal with multiple layers of varying thickness, while still including small details. Moreover, generating the mesh must be scaled correctly both to capture the relevant physics and to avoid meshes, which overwhelm computational resources. These issues will be addressed in this Tech Café with our invited speakers Simone Sala from STMicroelectronics and Sébastien Kawka, application manager at COMSOL France.

Developing and Deploying Simulation Apps

The Application Builder is included in the COMSOL Multiphysics® software and allows you to transform your models into simulation apps controlled by interfaces appropriate for what is being simulated. This type of tool is unique to COMSOL Multiphysics® and will open up the world of simulation to all engineers, operators of processes, and scientists. This session will demonstrate the use of the Application Builder and how it can fundamentally augment how your organization approaches simulation.

1:45 p.m.
Q&A
2:00 p.m.

Damien Radisson, Soitec

Advanced microelectronics applications require integration of thin layers of new materials with traditional support templates. The ever-growing demands for the quality of these layers call for monocrystalline layers with very low crystallographic defect densities, which are well below detection limits of traditional characterization techniques such as TEM- or X-ray-based characterization. The situation is accentuated by the use of the active layers with thickness in nanometer scale, which limits electrical or optical characterization such as PL or EBIC. We propose to use a highly anisotropic chemical etch for delineation of extended defects in thin layers. We are using COMSOL Multiphysics® with deformed geometry and automatic remeshing to model the molten KOH etching of thin SiC layers transferred on a SiC substrate by Smart Cut™ technology.

2:20 p.m.
Q&A
2:30 p.m.

The laws of heat transfer at the nanoscale differ from those at the macroscale. How different are they? How do the equations and numerical methods change? Is it even worth the effort to take the difference into account? Finally, what needs to be done to implement these changes in COMSOL Multiphysics®? All these questions will be addressed in this Tech Café with our invited speakers Pierre-Olivier Chapuis from CETHIL and Nicolas Huc, technology manager for heat transfer at COMSOL.

3:00 p.m.
Q&A
3:15 p.m.

Micro- and nanotechnologies are a growing market. With large investments being made in both design and manufacturing, return on investment becomes more important. The overall contribution of physics simulation software (whether it be multiscale, multiphysics, or system integration) toward better ROI comes from reducing prototypes and tests at these very small length scales, thereby shortening time to market and increasing performance. As simulation proves its value and starts to spread throughout R&D organizations, the question of deployment for nonspecialists must be addressed. In this panel discussion, we will cover all of these issues with invited panelists from key companies and R&D institutes.

4:00 p.m.
Closing Remarks

COMSOL Speakers

Jean-Marc Petit
Business Development Manager
Jean-Marc Petit joined COMSOL France in 2003 and is now in charge of business development. He holds a PhD in physics from the University of Orsay at CEA Saclay. He conducted research at ESRF and contributed to R&D at L'Oréal.
Eric Favre
Managing Director, France
Eric Favre has run COMSOL France since its creation. He previously worked in the field of magnetohydrodynamics (MHD) after receiving his PhD from the Grenoble Institute of Technology.
Sebastien Kawka
Applications Manager
Sébastien Kawka is responsible for the applications group at COMSOL France. He is an alumnus of the École Normale Supérieure de Lyon and holds a PhD in theoretical physics from the University of Grenoble. He worked as a researcher at the Scuola Normale Superiore in Italy before joining COMSOL.
Mickael Barsive
Applications Engineer
Mickaël Barsive joined COMSOL France as an applications engineer in 2016. He received his master's degree in subatomic physics and astroparticles from the University of Strasbourg.
Caroline Dubois
Applications Engineer
Caroline Dubois joined COMSOL in 2018 as an applications engineer. She received her mechanical engineering degree, specialized in fluid mechanics and heat transfer, from the National Institute of Applied Sciences (INSA) of Toulouse.
Loic Renversade
Applications Engineer
Loïc Renversade is an applications engineer at COMSOL. Before joining the company in 2019, he held a two-year postdoctoral position at CEA, working on an X-ray microdiffraction beamline of ESRF. He has an engineering degree from École des Mines de Saint-Etienne and a PhD in materials science from the Université de Lyon.
Nicolas Huc
Technology Director
Nicolas Huc joined COMSOL France in 2004 and is currently the head of their development team. He is also the manager of the Heat Transfer Module. Nicolas studied engineering at ENSIMAG before receiving his PhD in living system modeling from Joseph Fourier University.
Phil Kinnane
Senior VP of Sales
Phil Kinnane is the senior VP of sales at COMSOL, Inc., and has been with COMSOL since 2000. Previously, he worked in industry and has modeling and simulation experience within a variety of engineering fields. He earned his PhD in electrochemical engineering from the Royal Institute of Technology (KTH), Stockholm.

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COMSOL Day Details

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October 14, 2021 | 9:30 a.m. CEST (UTC+02:00)
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Invited Speakers & Panelists

Alexandre Reinhardt CEA-LETI

Alexandre Reinhardt is a research engineer at CEA-LETI in Grenoble. He received an engineering diploma from the Ecole Centrale de Lille and a master's degree in acoustics and telecommunications from the Université de Valenciennes et du Hainaut Cambresis in 2001. He then performed a PhD on the modeling and fabrication of bulk acoustic wave resonators at the FEMTO-ST Institute in Besançon. After a postdoctoral stay at the University of Bath (U.K.), he joined CEA-LETI to work on the development of a bulk acoustic wave filter technology in 2006. Since then, he continues to develop new generations of radiofrequency resonators and filters exploiting new types of propagation modes or device architectures.

Lanny Liang STMicrolelectronics

Lanny Liang has been a power package design engineer in the Power Module Department at STMicroelectronics since 2020. He graduated from KTH Royal Institute of Sweden with an MSc in engineering mechanics. He is specialized in mechanical and thermal FE modeling to analyze manufacturing processes and package performances.

Olga Cueto CEA-Leti

Olga Cueto graduated from “Ecole des Ponts Paris Tech” in Paris in 1991, with a specialization in computer science and applied mathematics. In 1991, she joined CEA Grenoble to work in computational fluid dynamics applied to muclear reactor thermohydraulics. In 2001, she moved to CEA LETI, where she has been working in scientific computing applied to several fields in microelectronics: electromagnetism; process simulation; and, more recently, the simulation of phase change memories (PCM) in collaboration with STMicroelectronics. Since 2017, she has been working with PhD students in collaboration with LPMC (CNRS & Ecole Polytechnique) and STMicroelectronics on the development of a model dedicated to complex phase changes in GeSbTe alloys relying on the phase field method. She is the author or coauthor of 55 articles in the field of microelectronics, including 20 in the field of emerging resistive memories (PCM, OXRAM, CBRAM).

Simone Antonio Sala STMicroelectronics

Simone Antonio Sala is a senior technology development engineer at STMicroelectronics. He has a master’s degree in materials engineering from Politecnico of Milan. After previous experience as a process engineer, he is currently working on smart power technology, focusing on FEM simulations to study the interaction between silicon chips and packages (FE-BE compatibility).

Damien Radisson Soitec

Damien Radisson has been a modeling engineer at Soitec since 2015. He graduated from Grenoble INP - Phelma with an MSc in materials science and engineering. He has used FEM modeling since his PhD on wafer direct bonding of patterned surfaces at CEA-Leti. His activities as a modeling engineer at Soitec, within the Expertise Lab, involve a lot of different subjects and physics, aiming to improve physical understanding, develop more efficiently, and capitalize our knowledge.

Pierre-Olivier Chapuis Centre d'Energétique et de Thermique de Lyon (CETHIL)

Pierre-Olivier Chapuis is a CNRS researcher at the Centre d'Energétique et de Thermique de Lyon (CETHIL), located at INSA Lyon. He has an engineering degree and PhD from Ecole Centrale Paris (now CentraleSupelec), and he is a specialist in energy transfers in nanomaterials and nanocomponents, particularly for thermal management, nanometrology, and energy recovery.

Lucia Zullino STMicroelectronics

Lucia Zullino received the laurea degree in condensed matter physics from the University of Pavia in 1982. After one year of postgraduate work at the University of Pavia and three years spent with an aeronautical firm, she joined STMicroelectronics. There, she was committed to technology CAD activities within the mixed bipolar-CMOS-DMOS technology design group, contributing to the development of several smart power technological nodes. She became a COMSOL Multiphysics® user in 2004 and, starting from 2008, she coordinates the Italian COMSOL® software user group at STMicroelectronics. As of 2009, she is a senior member of their technical staff. She manages, at present, the T-CAD Competence Center of the Smart Power Technology R&D Department.

Nicolas Daval Soitec

Nicolas Daval has been working in the field of smart cut R&D and manufacturing for more than 20 years within Soitec. He holds a PhD in power device design on SiCOI substrates. As the expertise lab manager in the Soitec innovation team, he leads a team of PhDs and engineers developing and industrializing new technologies that enable engineered substrates to bring more performance and value for the end customer of the electronic application. In this activity, modeling and simulation are key assets to improving physical understanding, developing more efficiently, and capitalizing our knowledge.

Virginie Dallot Vishay

Virginie Dallot is a doctor in physics (Telecom Paris) and has worked in innovation and R&D activities for more than 20 years. Her initial academic background and some additional trainings (MSc in software engineering - ENS Mines Saint-Etienne, MSc in strategy and management of international business - ESSEC Business School, business and IT law - CNAM) have enabled her to acquire a large portfolio of competences and thereby take over different positions in several expertise fields (IT, telecommunications, optoelectronics and semiconductors, aeronautics, etc.) in major and high-tech companies (Safran, Schneider Electric, Almerys, MySphera, etc.) Since 2020, she has taken on the position of R&D director in Vishay, an international company and leader in electronics.

Jean-René Lèquepeys CEA Leti

Jean-René Lèquepeys received his engineering degree in 1983 from Supélec and taught physics for 2 years in Ouarzazate, Morocco. He joined CEA in October 1985, in Saclay, within the Central Security Office, in the laboratory for the evaluation of means of detection and intrusion. In 1987, he held the position of head of the laboratory. In 1993, he was recruited by DSYS, at LETI in Grenoble, as an R&D engineer, in the field of image processing. He then led projects in the field of telecom at LETI before being named the head of "Telecom, Communicating Objects and Smart Card" programs in 1999, within the team of Jean-Frédéric Clerc. In 2005, he took charge of the Circuits Design department at LETI/DSYS, and then created, in partenership with the Ecole des Mines de Saint-Etienne, a laboratory dedicated to electronic component safety analysis, located in Gardanne (Paca). In 2010, from the common initiative of both LETI and LIST directors, he launched the DACLE division, relying on the original bisite and bi-institute model and focusing on electronic architectures, integrated circuit design, and embedded software. He participated in the creation of the Division DCOS (Division of Silicon Components) in 2011, and then led the division until the end of 2017, when he returned as the head of the DACLE division in 2018. In 2000, Jean-René Lèquepeys received the famous award from SEE, "Grand Prix de l'électronique Général Ferrié", for his work in the telecommunications field. He is the author of about fifteen patents in this field. In 2019, he was appointed deputy director in charge of programs at LETI and deputy director of the director of LETI.