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Convection Cooling of Circuit Boards - 3D Natural Convection

Application ID: 449

The suite of models examine the air cooling of circuit boards populated with multiple integrated circuits (ICs), which act as heat sources. Two possible cooling scenarios are depicted: vertically aligned boards using natural convection, and horizontal boards with forced convection (fan cooling). In this case, contributions caused by the induced (forced) flow of air dominate the cooling. To achieve high accuracy, the simulation models heat transport in combination with the fluid flow.

The example models the heat transfer of a circuit-board assembly using the Heat Transfer Module’s Conjugate Heat Transfer predefined multiphysics coupling. The modeled scenario is based on work published by A. Ortega.

This application was built using the following:

Heat Transfer Module

The combination of COMSOL® products required to model your application depends on the physics interfaces that define it. Particular physics interfaces may be common to several products (see the Specification Chart for more details). To determine the right combination of products for your project, you should evaluate all of your needs in light of each product's capabilities, consultation with the COMSOL Sales and Support teams, and the use of an evaluation license.