Electrodeposition on a Resistive Patterned Wafer

Application ID: 12361


This example models time-dependent copper deposition on a resistive wafer in a cupplater reactor. As the deposited layer builds up, the resistive losses of the deposited layer decreases. The benefit of using a current thief for a more uniform deposit is demonstrated.

This model is included as an example in the following products:

Electrodeposition Module