Simulation of a Microrobot, 3D
Application ID: 726
A microrobot's leg, which structurally moves due to the rapid application of heat, is modeled in this example. Heat is generated by an electric current and propagates by conduction through the leg and, due to thermal expansion and different thermal expansion coefficients of the leg's materials, a bending action is induced.
Thin layers of Al and SiO have also been modeled using a structural shell application mode and two specific thermal boundary conditions, so that the high and poor conductivity characteristics of each layer is respectively captured.
As the time-scale of the structural mechanics part is much smaller compared to the heat transfer part, we can neglect mass effects in the structural analysis.