The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.

Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. To download the MPH-files, log in or create a COMSOL Access account that is associated with a valid COMSOL license. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.


Nonisothermal MEMS Heat Exchanger

The example concerns a stainless-steel MEMS heat exchanger, which you can find in lab-on-a-chip devices in biotechnology and in microreactors such as for micro fuel cells. This model examines the heat exchanger in 3D, and it involves heat transfer through both convection and conduction. The model solves for the temperature and heat flux in the device and investigate the convective term’s ...

Disk-Stack Heat Sink

This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to even out the temperature distribution. This exercise highlights a number of useful modeling techniques such ...

Radiative Heat Transfer in Finite Cylindrical Media—P1 Method

This model uses the Discrete-Ordinates method (DOM) to solve a 3D radiative transfer problem in an emitting, absorbing, and linear-anisotropic scattering finite cylindrical medium. Using the S6 quadrature of DOM leads to faster and more accurate results, which are needed in combined modes of heat transfer. The calculated incident radiation and heat fluxes agree well with published results ...

Composite Thermal Barrier

This example shows how to set up multiple sandwiched thin layers with different thermal conductivities in two different ways. First, the composite is modeled as a 3D object. In the second approach the Thin thermally resistive layer boundary condition is used to avoid resolving the thin domains. The technique is useful when modeling heat transfer through thermal barriers like multilayer coatings.

Thermoelectric Leg

A thermoelectric leg is a fundamental component of a thermoelectric cooler (or heater). For example, a thermocouple is a thermoelectric module typically made of two thermoelectric legs: one made of p-type and of one n-type semiconductor material which are connected in series electrically and in parallel thermally.

Radiative Cooling of a Glass Plate

When producing glass, the glass melt is cooled down through radiation to form the final shape, subjecting it to stresses. Numerical treatment of radiative heat transfer, using the Radiative Transfer Equation (RTE), helps to optimize this process. COMSOL Multiphysics provides three discretization methods for modeling radiation in participating media and solving the RTE: the Rosseland ...

Finned Pipe

Finned pipes are used for coolers, heaters, or heat exchangers to increase heat transfer. They come in different sizes and designs depending on the application and requirements. When the fins are placed outside the pipe, they increase the heat exchange surface of the pipe so that a cooling or heating external fluid can exchange heat more efficiently. When placed inside the pipe, it is the inner ...

Heat Conduction in a Finite Slab

This simple example covers the heating of a finite slab and how the temperature varies with time. We will set up the problem in COMSOL Multiphysics after which we compare the solution to the analytical solution.

Natural convection in a closed cavity with mass conservation

Only fully compressible flow can guarantee the mass conservation in time in a closed cavity where the temperature increases. This is a simple proof of concept using the "gravity" option available in V5.2A.

Rapid Thermal Annealing

In the semiconductor industry, rapid thermal annealing (RTA) is a semiconductor process step used for the activation of dopants and the interfacial reaction of metal contacts. In principle, the operation involves rapid heating of a wafer from ambient to approximately 1000–1500 K. As soon as the wafer reaches this temperature, it is held there for a few seconds and then finally quenched. An ...