Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

The use of COMSOL for Building Constructions Engineering Regarding Heat and Moisture Transport

H. Schellen, A. van Schijndel, and P. Briggen
Eindhoven University of Technology, Eindhoven, Netherlands

Hunting Lodge St. Hubertus is one of the most prominent Dutch buildings from the early twentieth century. An extensive study of wind and wind-driven rain (WDR) was conducted to provide insight into the moisture load of the building facade, using measurements and CFD simulations. COMSOL Multiphysics was also used for modeling the moisture transport through the walls of the tower. The model ...

Study of the Thermal Behavior of Solar Cells Based on GaAs

N. Martaj[1,2], E. Guidicelli[2], Y. Cuminal[2], A. Perona[3], S. Pincemin[1,2]
[1]EPF-Ecole d’Ingénieurs, Montpellier, France
[2]IES, UMR5214, Université Montpellier II, Montpellier, France
[3]Laboratoire PROMES-CNRS Tecnosud, Rambla de la thermodynamique, Perpignan, France

The paper studies the thermal modeling and simulation of photovoltaic cells suitable for use in highly concentrated solar flux (> 1000 suns). The cells studied are those of GaAs kind. These cells are a very good alternative to be studied instead of more complex multi junctions cells. The objective is to find a simple and inexpensive way to remove heat from PV modules and to keep the electrical ...

螺旋推进器对改善微波加热均匀性的研究

叶菁华 [1], 朱铧丞 [1],
[1] 四川大学,成都,四川,中国

为了解决工业应用上微波加热过程中普遍存在的能量不集中,加热不均匀等问题,本文提出了一种管道式螺旋推进微波加热装置的设计方案。计算模型如图1所示,螺旋推进器位于管道的中心,当装置工作时,螺旋推进器将绕中心轴旋转。 在该计算模型中,电磁场、搅拌和流体传热接口相互耦合计算。首先,针对电磁场接口,本文将材料介电常数表达为空间坐标和时间的函数,在每一个时间步内在频域求解腔体内的电磁场分布和电磁耗散功率。然后,利用旋转机械流接口和流体传热接口在时域耦合求解管道内液体的流速、压力和温度分布,其中电磁耗散功率作为热源代入到流体传热接口中,旋转机械流接口求得的流速作为流体传热接口的模型输入。总体的计算流程图如图2所示。 为了更好地观察螺旋推进器对改善微波加热均匀性的影响,本文同时对无螺旋推进器的管道微波加热装置进行了仿真,在螺旋推进器转速为每秒0.2圈,加热8秒之后管道出口的温度分布对比图如图3所示 ...

Using COMSOL to Estimate the Heat Losses of Composite Panels Undergoing Repairs Using Bayesian Inference

A. Emery[1]
[1]University of Washington, Seattle, WA, USA

Composite repairs involve applying a prescribed heat flux which must be adjusted to account for heat losses. These losses must be estimated. Parameter estimation requires a knowledge of sensitivities. This is often done using finite differences. As shown in the figure, substantial errors often occur. The paper describes the use of the PDE features of COMSOL to obtain much more accurate values by ...

Building a Complex Geological Model Using Parametric Surfaces

S. Hoyer[1], M. Bottig[1], F. Zekiri[1], G. Götzl[1], A.K. Brüstle[1], G. Schubert[1], A. Nador[2]
[1]Geological survey of Austria, Vienna, Austria
[2]Geological Institute of Hungary, Budapest, Hungary

Temperature measurements of the subsurface are available due to hydrocarbon exploration in the project area, where the average drilling depth is about 2-4 km and the deepest well reaches about 8.5 km. Since the data is heavily uneven distributed, standard interpolation techniques did not deliver satisfying results. This is why numerical modeling was applied to assess the thermal regime of the ...

An Approach to Modeling Vacuum Desorption - new

C. F. Gomez[1], R. Schunk[1], R. F. Coker[1], J. Knox[1]
[1]NASA Marshall Space Flight Center, Huntsville, AL, USA

The objective of this simulation effort is to develop a mathematical model of vacuum desorption on a POC (Proof of Concept) canister loaded with Zeolite 13X/5A . This canister contains a pelletized adsorption bed which is used to adsorb H2O and CO2. Once this bed is fully saturated with an equilibrium loading, desorption is then accomplished by reducing the pressure to near vacuum. This type of ...

Influência das Condições Ambientais Sobre a Umidade e Temperatura em Bobinas de Cartão - new

I. Neitzel[1], R. C. F. do Nascimento[1], C. C. Bueno[1]
[1]Faculdade de Telêmaco Borba - FATEB, Telêmaco Borba, Paraná, Brasil

Neste trabalho é analisado o comportamento dos perfis de temperatura e umidade e sua penetração em bobinas de papel submetidas a longos períodos de armazenagem. O modelo considera a transferência simultânea de calor e massa com o efeito Soret, mas sem o efeito Latour. O sistema é fechado em relação à umidade e aberto em relação à energia. As propriedades térmicas são dependentes da umidade e ...

COMSOL® Implementation of a Viscoelastic Model with Cure-Temperature-Time Superposition for Predicting Cure Stresses and Springback in a Thermoset Resistant

B. Patham[1]
[1] General Motors Global Research and Development, India Science Lab, GM Technical Centre India.

Multi-physics simulations of the evolution of cure induced stresses in a viscoelastic thermoset polymeric resin are presented. The viscoelastic material model is implemented with a relaxation spectrum with 34 relaxation time constants. The trends in viscoelastic stresses at different degrees of cure and temperatures are compared and contrasted with an equivalent cure–dependent (but ...

Analysis of Infrared Signature of a Ship Operating in MIR and FIR Bands

A. Pellegrini[1], A. Beucci[1], and F. Costa[1]

[1]ALTRAN Italia, Pisa, Italy

In this paper a methodology for calculating the infrared signature of complex objects is presented. The transient thermal analysis allows us to evaluate the temperature distribution on the investigated object, pointing out which parts tend to be warmer. These temperature values are handled in the post processing phase in order to evaluate the zero range radiance distribution and the radiance of ...

Thermal FEM Simulation Of A Multilevel Lab On Chip Device For Genetic Analysis

E. Giuri, A. Ricci, and S.L. Marasso
Politecnico di Torino, Materials Science and Chemical Engineering Department, Turin, Italy

In this work, time dependent thermal analyses, performed on the 3D FE model of a multilevel Lab on Chip (LOC) platform are executed in order to gain insight into the temperature distribution within the device. By means of the COMSOL Multiphysics CAD import module, an extremely close 3D reproduction of the actual device, allowing to probe temperatures in those regions where an experimental ...