Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

The Spiral RF MEMS Switch in COMSOL Multiphysics

K. M. V. Swamy[1], B. G. Sheeparamatti[1], G. R. Prakash[1]
[1]Basaveshwara Engineering Collage, Bagalkot, Karnataka, India

This work presents the study of spiral RF MEMS switch which has low actuation voltage due to spiral structure. This work is inspired by the superior performance of electrostatic RF MEMS switches over the conventional state-of-the-art solid-state devices and the potential applications in communication field. The customary high actuation voltage limits the reliability and applications especially ...

Design and Optimization of Highly Sensitive Single Axis Accelerometer using COMSOL Multiphysics®

Kunal A.Kshirsagar[1], K.Govardhan[1],
[1]VIT University, Sensor System Technology, School of Electronics Engineering, Vellore, Tamil Nadu, India
[2]VIT University, MEMS & Sensor Division, School of Electronics Engineering, Vellore, Tamil Nadu, India

Accelerometers are successfully commercialized MEMS devices. COMSOL Multiphysics® has been used in the modeling, simulation and optimizing of this design. The piezoresistive accelerometer is made up of a square proof mass with flexures supporting it. The piezoresistors are placed near the proof mass and frame ends of the flexure and the springs. There is an elongation or shortening of the ...

Heterodimensional Charge-Carrier Confinement in Sub-Monolayer InAs in GaAs - new

S. Harrison[1], M. Young[1], M. Hayne[1], P. D. Hodgson[1], R. J. Young[1], A. Strittmatter[2], A. Lenz[2], U. W. Pohl[2], D. Bimberg[2]
[1]Department of Physics, Lancaster University, Lancaster, UK
[2]Institut für Festkörperphysik, Berlin, Germany

Low-dimensional semiconductor nanostructures, in which charge carriers are confined in a number of spatial dimensions, are the focus of much solid-state physics research, offering superior optical and electronic properties over their bulk counterparts. Both two-dimensional (2D) and zero-dimensional (0D) structures have seen wide-ranging applications in laser diodes, solar cells and LEDs to name ...

Coupled Electromagnetic - Dynamic FEM Simulation of A High Frequency MEMS Energy Harvester

E. Topal
Middle East Technical University

In this study, a detailed finite element model coupling the motion dynamics and electromagnetics of a diaphragm based MEMS vibration energy harvester is presented. The energy harvester converts low frequency vibrations to high frequency response by magnetic actuation of a diaphragm carrying coils. AC/DC, Solid Mechanics and Moving Mesh (ALE) modules are coupled together in one 3-D model to ...

AC Electrothermal Characterization of Doped-Si Heated Microcantilevers Using Frequency-Domain Finite Element Analysis - new

K. Park[1], S. Hamian[1], A. M. Gauffreau[2], T. Walsh[2]
[1]Mechanical Engineering Department, University of Utah, Salt Lake City, UT, USA
[2]Department of Mechanical, Industrial & Systems Engineering, University of Rhode Island, Kingston, RI, USA

This work investigates the frequency-dependent electrothermal behaviors of freestanding doped-silicon heated microcantilever probes operating under the periodic (ac) Joule heating. The transient heat conduction equation for each component (i.e., the low-doped heater region, the high-doped constriction region, and the high-doped leg region) is solved using the general heat transfer module for DC ...

Void Shape Evolution of Silicon Simulation in COMSOL Multiphysics®

C. Grau Turuelo[1], B. Bergmann[1], C. Breitkopf[1]
[1]Technische Universität Dresden, Dresden, Germany

The void shape evolution of a trench patterned silicon substrate results in diverse cavities by varying initial conditions. The size and the arrangement of the initial trenches are decisive for the transformation process besides the annealing conditions which are, in fact, time and temperature, and the existing pressure values. The prediction of the shape evolution depending on different ...

COMSOL Multiphysics Applied to MEMS Simulation and Design

Dr. Piotr Kropelnicki[1]
Mu Xiao Jing[1]
Wan Chia Ang[1]
Cai Hong[1]
Andrew B. Randles[1]

[1]Institute of Microelectronics, Agency for Science, Technology and Research, Singapore, Singapore

In this research, we performed multiple COMSOL Multiphysics® simulations. We analyzed the dispersion curves of waves in a LAMB wave pressure sensor; simulated a thin metal film in a microbolometer and observed the resulting stress; investigated the thermal behavior of an acoustic wave microbolometer; and modeled the fluid-structure interaction (FSI) for piezoelectric-based energy harvesting from ...

Carbon MEMS Accelerometer

J. Strong, and C. Washburn
Sandia National Laboratories
Albuquerque, NM

The newly emerging field of carbon-based MEMS (C-MEMS) attempts to utilize the diverse properties of carbon to push the performance of MEMS devices beyond what is currently achievable. Our design employs a carbon-carbon composite using nano-materials to build a new class of MEMS accelerometer that is hyper-sensitive over a dynamic range from micro-G to hundreds of G’s – far surpassing the ...

Electric Field Density Distribution for Cochlear Implant Electrodes

N.S. Lawand[1], J. van Driel[2], P.J. French[2]
[1]Electronic Instrumentation Laboratory (EILab), Faculty of Electrical Engineering, Mathematics and Computer Science (EEMCS), Delft University of Technology, Delft, The Netherlands
[2]Delft University of Technology, Delft, The Netherlands

Cochlear Implants are implantable devices which bypasses the non-functional inner ear and directly stimulates the hearing nerve with electric currents thus enabling deaf people to experience sound again. Implant electrode array design is limited in electrode count, due to their large size in accordance to scala tympani (ST) with restrictions for deeper insertion in ST thus depriving access to ...

Interactive Design of an Electrostatic Headphone Speaker Using COMSOL Server™

B. A. Marmo [1], M. P. Snaith [1],
[1] Xi Engineering Consultants, Edinburgh, United Kingdom

An electrostatic headphone includes many interrelated design elements that affect the frequency response of the headphone and the users listening experience. Xi Engineering Consultants (XI) partnered with Warwick Audio Technologies (WAT) to investigate the complex behavior of one-side electrostatic speakers. Xi developed a GUI that helped WAT engineers optimize their speaker using virtual tools ...