Technical Papers and Presentations

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Designing Materials for Mechanical Invisibility Cloaks

P. Olsson[1], F. Larsson[1], A. Khlopotin[1], S. Razanica[1]
[1]Chalmers University of Technology, Gothenburg, Sweden

In solid mechanics, there is considerable interest in achieving “invisibility”. The applications in mechanics include protection of structures and parts of structures from potentially harmful transient waves and steady state vibrations. A suggested large scale application is that protection against seismic waves from earthquakes could be achieved by using cloaking to re-route the waves around ...

A Computational Approach for Optimizing the First Flyer Using COMSOL Multiphysics

A.H. Aziz[1], H. Pourzand[1], A.K. Singh[1]
[1]Pennsylvania State University, University Park, PA, USA

COMSOL Multiphysics software was used to structurally optimize the Wright brothers’ flyer. The flyer was drawn in SolidWorks, imported and meshed in COMSOL. COMSOL Solid Mechanics module was used to analyze the flyer. Four of the sixteen struts were removed yet the structural integrity of the flyer was maintained. COMSOL Laminar Flow module was used to compute the aerodynamic forces and ...

Sliding Performance of a Hyperelastic Seal

H. van Halewijn[1]
[1]Physixfactor, Nijmegen, The Netherlands.

A hyperelastic seal is pulled over a metal ring in a coffee machine for maintenance reasons. The force needed to pull the hyper elastic seal over the part is too high and should be reduced for maintenance reasons. Using the COMSOL Multiphysics® Structural Mechanics Module, and using the non-linear hyperelastic for the stick slip movement, a reliable simulation was generated. It resulted in an ...

Simulations of Micropumps Based on Tilted Flexible Structures

M. J. Hancock[1], N. H. Elabbasi[1], M. C. Demirel[2]
[1]Veryst Engineering, LLC., Needham, MA, USA
[2]Pennsylvania State University, University Park, PA, USA

Pumping liquids at small scales is challenging because of the principle of reversibility: in a viscous regime, the flow streamlines through a fixed geometry are the same regardless of flow direction. Recently we developed a class of microfluidic pump designs based on tilted flexible structures that combines the concepts of cilia (flexible elastic elements) and rectifiers (e.g., Tesla pump). We ...

Analysis to Determine Optimum Strain Gauge Locations for SENSEWHEEL

T. Suzuki[1], C. Holloway[1], S. Taylor[1]
[1]University College London, London, UK

Manual wheelchair users suffer shoulder pain and injury in the long term because of unconscious overuse. The ‘SENSEWHEEL’, which interposes three identical load cells between pushrim and rear wheel, measures the three components of pushing force Fx, Fy and Fz, and axial torque Tx applied at each load cell. Strain gauges were located on a diaphragm forming one face of the load cell. The ...

Numerically Closing the Loop of the Adaptive Optics Sensor: the Validation of the COMSOL Multiphysics® Simulation

C. Del Vecchio[1], R. Briguglio[1], A. Riccardi[1]
[1]National Institute for Astrophysics, Arcetri Astrophysical Observatory, Florence, Italy

As any other modelling of a physical behavior, the numerical simulation of the mechanical response of an adaptive secondary mirror requires that the results match the experimental data. Such an agreement was recently demonstrated for the local mirror stiffness of the LBT and VLT Deformable Mirrors; a reliable modeling is a good tool for the extrapolation of the missing optical data (spider ...

Simulation of Hygro Swelling Induced Stresses in Flip Chip Interconnects in a Stress-Sensitive Chip-on-Board Configuration

M. Fretz
Optics & Packaging, CSEM SA, Central Switzerland Center, Alpnach, Switzerland

Flip chip interconnections are used for the direct electrical connection of face-down electronic components like MEMS pressure sensors. The investigated bonding technologies are gold stud bumping in combination with anisotropic conductive adhesives (ACA) and solder ball bumping in combination with underfill in a chip-on-board configuration. The modeled chip is an absolute pressure sensor based on ...

Modelling of Lintel-Masonry Interaction Using COMSOL

A. Vermeltfoort, and A. van Schijndel
Eindhoven University of Technology, Netherlands

An attempt was made, as described in this paper, to assign material properties like shear strength and modulus of elasticity randomly. In this way, the behaviour of a masonry wall with a prefabricated concrete lintel was experimentally tested and simulated using COMSOL. The paper confirms the possible use of COMSOL for modelling lintel-masonry interaction, including variation of mechanical ...

An Analysis of Plunger Temperature during Glass Parison Pressing

P. Ngankeu[1], and E. Gutierrez-Miravete[2]

[1]EMHART Glass Research Inc, Windsor, CT, USA
[2]Rensselaer at Hartford, Hartford, CT, USA

The press and blow (P&B) process is widely used to produce glass containers. While the P&B process has demonstrated to be capable of reducing container weight by as much as 33%, it can also induce the formation of micro-checks that weaken container strength. This paper presents a model of the heat transfer due to the intermittent contact of glass with the plunger during several pressing ...

Stress State Determination in Nanoelectronic Silicon Devices Coupling COMSOL Multiphysics and a Recursive Dynamical CBED Pattern Simulation

A. Spessot[1,2], S. Frabboni[1], A. Armigliato[3], and R. Balboni[3]
[1]Numonyx Advanced R&D NVMTD-FTM, Agrate Brianza, Italy
[2]National Research Center S3, CNR-INFM and Department of Physics, University of Modena e Reggio Emilia, Modena, Italy
[3]CNR-IMM Section of Bologna, Italy

Strained technology is being promoted as the best way to extend the performance of semiconductor transistors. An inhomogeneous layer deposited on top of a silicon device can induce a strong modification in the real silicon strain state, and consequently in its electronic performance. Coupling the finite elements analysis done by COMSOL with a recursive CBED and LACBED dynamical simulation, we are ...

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