Technical Papers and Presentations

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Micromechanical Design of Novel Thermal Composites for Temperature Dependent Thermal Conductivity - new

R. C. Thiagarajan[1],
[1]ATOA Scientific Technologies Pvt. Ltd., Bengaluru, Karnataka, India

Materials with an order variable in thermal conductivity as a function of temperature are desirable for thermoelectric heat energy recovery, building thermal insulation and solar thermal applications. Thermal Conductivity is an inherent material property. Engineering the fundamental thermal conductivity needs manipulation at thermal photon level for conventional materials. Engineering thermal ...

An Analysis of Plunger Temperature during Glass Parison Pressing

P. Ngankeu[1], and E. Gutierrez-Miravete[2]

[1]EMHART Glass Research Inc, Windsor, CT, USA
[2]Rensselaer at Hartford, Hartford, CT, USA

The press and blow (P&B) process is widely used to produce glass containers. While the P&B process has demonstrated to be capable of reducing container weight by as much as 33%, it can also induce the formation of micro-checks that weaken container strength. This paper presents a model of the heat transfer due to the intermittent contact of glass with the plunger during several pressing ...

Modeling and Simulation of High Sensitivity CMOS Pressure Sensor Using Free Boundary Circular Diaphragm Embedded on Ring Channel Shaped MOSFET - new

S. Joy[1], T. Tom[1]
[1]Rajagiri School of Engineering and Technology, Kochi, Kerala, India

Sensors have diverse applications ranging from the medical field to space exploration. They convert physical parameters such as temperature, pressure, humidity etc. into an electrical output. The discovery of piezoresistivity property of silicon and germanium led to miniaturization of pressure sensors. Improvement in the sensitivity is the major factor to be considered while designing pressure ...

Modelling of Lintel-Masonry Interaction Using COMSOL

A. Vermeltfoort, and A. van Schijndel
Eindhoven University of Technology, Netherlands

An attempt was made, as described in this paper, to assign material properties like shear strength and modulus of elasticity randomly. In this way, the behaviour of a masonry wall with a prefabricated concrete lintel was experimentally tested and simulated using COMSOL. The paper confirms the possible use of COMSOL for modelling lintel-masonry interaction, including variation of mechanical ...

Dynamics of Slender Structures

K. Lund
Kurt Lund Consulting, Del Mar, CA , USA

The present work formulates the dynamics of a slender structure as a long beam. This results in a PDE that is fourth-order in space, and second order in time. In COMSOL the coupling method is used to decompose this problem into two second-order equations, one for displacements, and one for bending moments, which are then solved to obtain frequencies and mode shapes. For verification of ...

Shearing of the Fiber-Matrix Composite Material and Elastic Properties of Unidirectional Ply

D. Remaoun, and A. Boutaous
Département de Physique, Université des Sciences et de la Technologie, Oran, Algérie

The present work aims to describe the behavior of the interface using the method of load transfer between fiber and matrix in a composite material. Our contribution was first to simulate the mechanical behavior of a composite, for a given radius of the fiber was able to automate the result for different rays thus different proportions of the reinforcement, the simulation was done with software ...

Time-Dependent Thermal Stress and Distortion Analysis During Additive Layer Manufacturing, by Powder Consolidation by Laser Heating

M.S. Yeoman[1], J. Sidhu[2]
[1]1. Continuum Blue Ltd., Tredomen Innovation & Technology Park, Tredomen, Ystrad Mynach, United Kingdom
[2]BAE Systems, Advanced Technology Centre, Bristol, United Kingdom

A time-dependent COMSOL Multiphysics model of an additive manufacture process, which uses powder consolidation by laser heating was developed, providing a platform to better understanding the manufacture process & provide a tool to reduce resulting distortion & optimization of an additive manufacture process. The model simulates a high intense laser energy source moving along a pre-defined time ...

Modeling the Temperature-Dependent Dynamic Behavior of a Timber Bridge with Asphalt Pavement

B. Weber[1]
[1]Empa, Swiss Federal Laboratories for Materials Science and Technology, Dübendorf, Switzerland

The fundamental frequency and the corresponding damping value are the main design parameters for footbridges against excessive vibrations induced by pedestrians. Since pedestrians typically walk at a pace of 1.6–2.4 Hz, this frequency range as well as the range of the second harmonic, namely 3.5–4.5 Hz, should be avoided. However it has been observed that the fundamental frequency of a bridge ...

Stress Distribution in Masonry Walls, Loaded in Plane, Simulated with COMSOL

A.T. Vermeltfoort, and J. van Schijndel
Eindhoven University of Technology, the Netherlands

The tensile strength of masonry is relatively low compared to its compressive strength and is affected by the direction of the joints and their filling. In masonry with modern thin layer mortar (joint thickness 3 to 5 mm) sometimes the head joints are left open. A total of 13 model-walls was built and for each model four general purpose mortar combinations and three thin layer mortar combinations ...

Electro-Thermo-Mechanical Finite Element Modeling to Investigate the Reliability of Automotive MOSFET Transistor

T. Azoui, P. Tounsi, and J.M. Dorkel
CNRS, LAAS, Toulouse, France

3D electro-thermo-mechanical finite element model of power vertical MOSFET used in the automotive industry is presented in this paper. The presented paper is a qualitative study of power device results from electro-thermo-mechanical simulation. This study particularly interested in the stress generated at the interface between the bonding wires and the source metallization to evaluate the ...

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